The bonding of aluminum wire based on conductive nanoparticle pastes
Aluminum is used in a nearly unlimited number of applications and industrial processes. There are many different ways to bond it, depending on the application, but commonly it is bonded using adhesive bonds or through soldering. However, adhesive bonds counteract the thermal and electrical conductivity of aluminum, and the very high temperatures involved in soldering the material make it unsuitable for a range of applications.
To bond aluminum at lower temperatures, but retaining the conductive properties in the joint, nanoparticles may be added to the otherwise insulating adhesive to form a paste that can bonds the aluminum, while still transferring heat and electricity
In this project we want to study the possibilities of bonding aluminum using these pastes and determine if the required strength and conductivity can be achieved, with the aim of using this into new assembly methods.
Project duration:
Fall 26/27
Internship or graduation project:
Open for internship or graduation project
Educational programs:
- Chemistry (CH),
- Chemical Technology (CT),
- Mechanical Engineering (WTB)
Interested? Please send your motivation letter and CV before the 7th of June to appliednanotechnology.led@saxion.nl and include Rick Sniekers (r.p.p.sniekers@saxion.nl) in the CC.